Science Links Japan | Measurement of Biaxial Stress by an Electrodeposited Copper Foil with a Microcircular Hole (Effect of Modulus of Elasticity of the Material).

TOP > J-EAST > List of Journal Titles (N) > Nippon Kikai Gakkai Chugoku Shikoku Shibu Sokai, Koenkai Koen Ronbunshu (1999) > Measurement of Biaxial Stress by an Electrodeposited Copper Foil with a Microcircular Hole (Effect of Modulus of Elasticity of the Material).

Measurement of Biaxial Stress by an Electrodeposited Copper Foil with a Microcircular Hole (Effect of Modulus of Elasticity of the Material).

Accession number;99A0415412

Title;Measurement of Biaxial Stress by an Electrodeposited Copper Foil with a Microcircular Hole (Effect of Modulus of Elasticity of the Material).

Author; KITAOKA SEIICHIRO (Tottori Univ.) UDA YASUHIRO (Teraru Kyokuto Inc.) YADA JUMPEI (Tottori Univ., Grad. Sch.)

Journal Title;Nippon Kikai Gakkai Chugoku Shikoku Shibu Sokai, Koenkai Koen Ronbunshu

Journal Code:L0015A

ISSN:

VOL.37th;NO.;PAGE.85-86(1999)

Figure&Table&Reference;FIG.4, TBL.2, REF.4

Pub. Country;Japan

Language;Japanese

Abstract;

Related Articles;