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Accession number;99A0272953
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| Title;Ecotechnology. Substrate metallization techniques with consideration on environment safety. |
| Author;
KATAYAMA KAZUO
(Taiheiboueki)
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Journal Title;Plant and Process
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Journal Code:G0109A
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ISSN:0368-4849
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VOL.;NO.;PAGE.123-125(1999)
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| Figure&Table&Reference;FIG.2 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;Electroless plating technique of SENSY Co. in Belgium was introduced which was developed as metallization technique of dielectric substrates such as printed circuit boards. It is a method using photosensitive palladium catalyst resin without etching by strong acid and enables partial plating of plastics selectively. The outline and the fastening process to the substrate surface were explained. Means of application of selective and non-selective metallization of the catalyst resin were explained. The metallization is possible for almost all types of substrate including plastics. |
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