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Accession number;99A0272954
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| Title;Ecotechnology. Packaging technique and environmental technology of CSP. |
| Author;
ANDO YUKIO
(Fujitsu Ltd.)
HASHITANI TAKAFUMI
(Fujitsu Lab. Ltd.)
TANAKA KATSUHIKO
(Shinanofujitsu)
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Journal Title;Plant and Process
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Journal Code:G0109A
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ISSN:0368-4849
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VOL.;NO.;PAGE.126-129(1999)
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| Figure&Table&Reference;FIG.7, TBL.1, REF.2 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;As a part of the environment measure, Fujitsu Ltd. developed tray for LSI and embossed tape using a biodegradable resin. This paper explained the outline of the conductive biodegradable resin and molding processing of large embossed tape to enable one-dimensional shipping of large PKG and introduced a supporting method of PKG to satisfy the dimensional accuracy and flatness of the CSP installation part and the situation of the CSP packaging techniques such as heat-resistance of the tape and a measure against static electricity. |
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