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Creep behavior of aluminum alloy foils for microelectronic circuits affected by grain orientation distribution.

Accession number;99A0488047

Title;Creep behavior of aluminum alloy foils for microelectronic circuits affected by grain orientation distribution.

Author; ZHOU Q (Nagaoka Univ. Technol.) YAMASHITA T (Nagaoka Univ. Technol.) ITOH G (Nagaoka Univ. Technol.)

Journal Title;Abstracts. Meeting of JIM

Journal Code:S0988A

ISSN:1342-5730

VOL.124th;NO.;PAGE.86(1999)

Figure&Table&Reference;

Pub. Country;Japan

Language;English

Abstract;

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