A Study of Wet Cleaning Process for ULSI Manufacturing.

Accession number;99A0938089
Title;A Study of Wet Cleaning Process for ULSI Manufacturing.
Author; TSUGA TOSHIHITO (Tohoku Univ.)
Journal Title;Record of Electrical and Communication Engineering Conversazione, Tohoku University
Journal Code:F0511A
ISSN:0385-7719
VOL.68;NO.1;PAGE.92-94(1999)
Figure&Table&Reference;FIG.6, REF.2
Pub. Country;Japan
Language;Japanese
Abstract;The wet cleaning system which can satisfy both high performance and high productivity was developed and the effects for future ULSI Manufacturing could be verified. The requirements for silicon wafer cleaning levels and for cleaning technology in and after sub-quarter micron devices were expressed clearly and the needs could be satisfied by newly developed single wafer wet cleaning system, that the cleaning process conditions were optimized. This paper shows the cleaning technology to offer ultra-clean silicon surface with high productivity. (author abst.)