Thermal analysis application for fabrication process development of high temperature composites.

Accession number;01A0903183
Title;Thermal analysis application for fabrication process development of high temperature composites.
Author; MIZUNO HIROSHI (Mitsubishi Heavy Ind., Ltd.) ISHIKIRIYAMA KAZUHIKO (Toray Research Center, Inc.) TAMURA HIROBUMI (Japan Aircr. Dev. Corp.)
Journal Title;Netsu Sokutei Toronkai Koen Yoshishu
Journal Code:F0840B
ISSN:
VOL.36th;NO.;PAGE.104-105(2000)
Figure&Table&Reference;FIG.8
Pub. Country;Japan
Language;Japanese
Abstract;To accomplish the commercial super sonic civil transport, a light weight polymer matrix composites primary structure is essential for fuselage and main wing, etc. For application of polymer matrix composites, design and manufacturing process development is key technology. In particularly, it is necessary to establish the manufacturing process for large complex shape parts, thus the clarify the curing mechanism of matrix resin is basic and essential stage for process development. In This study, a curing mechanism of the thermoset polymide were analized by fourier transform infrared spectroscopy(FT-IR), dynamic viscoelastic properties measurement, thermogravimetry-gas chromatography/mass spectrometry(TG-GC/MS), and temperature modulated differential scanning calorimetry(TMDSC). Based on these findings, a curing profile for the polyimide composites was proposed. (author abst.)