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Accession number;01A0903185
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| Title;Viscoelastic Behavior of an Epoxy Compound for Semiconductor Packages During Cure. |
| Author;
ISHIMURO YOSHITAKA
(Toray Research Center, Inc.)
TAKAHASHI HIDEAKI
(Toray Research Center, Inc.)
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Journal Title;Netsu Sokutei Toronkai Koen Yoshishu
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Journal Code:F0840B
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ISSN:
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VOL.36th;NO.;PAGE.108-109(2000)
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| Figure&Table&Reference;FIG.3, REF.5 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;Viscosity-time curves of an epoxy resin with 90wt% silica fillers were measured. In the range of 130.DEG.C. to 180.DEG.C., viscosity-time curves for samples which the concentrations of a curing catalyst had been decreased, in order to lower the rate of reaction, were measured. Parameters of an Arrhenius type equation, were obtained from these data, for the prediction of the resin viscosity variation during cure. The calculated viscosity profile coincided with the experimental data. The gel point at 100.DEG.C. was obtained using two methods (i) crossover of the tan.DELTA.-time curves at several frequencies (ii) same power law dependence of G'(.OMEGA.) and G"(.OMEGA.) on frequency. Both values coincided. These values were in agreement with the value predicted by the dynamic scaling theory. (author abst.) |
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