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Accession number;01A1026229
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| Title;Optimum Design of Silicon Wafer Polishing Machine for Planarization. Effect of Design Value on Relative Velocity. |
| Author;
MIYAJIMA TAKASHI
(Ind. Res. Inst. of Nagano)
KUDO SEIICHI
(Ind. Res. Inst. of Nagano)
HIRATA TERUHITO
(Naganodenshikogyo)
WADA MASAE
(Naganodenshikogyo)
NAKAMURA MASAYUKI
(Shinshu Univ., Fac. of Eng.)
KOBAYASHI MITSUYUKI
(Shinshu Univ., Fac. of Eng.)
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Journal Title;Naganoken Kogyo Shikenjo Kenkyu Hokoku
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Journal Code:Y0010A
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ISSN:0913-672X
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VOL.;NO.21;PAGE.59-63(2001)
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| Figure&Table&Reference;FIG.6, TBL.2, REF.4 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;The design value of a silicon wafer polishing machine such as radius ratio, rotational velocity ratio, attachment position, rocking cycle and rocking amplitude has great effect on planarization of the silicon wafer. Relative velocity is one of factors which determines polishing quantity. The purpose of this study is optimization of the design value of polishing machine for planarization of the silicon wafer. In this paper, relative slide distance was substituted for polishing quantity and it was investigated how design value influenced relative slide distance. (author abst.) |
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