A Simulation Method for EM Radiation from Power/Ground Plane of PCB by Using a Power Current Model.

Accession number;03A0117009
Title;A Simulation Method for EM Radiation from Power/Ground Plane of PCB by Using a Power Current Model.
Author; TAKAYAMA KEISUKE (Okayama Univ., Faculty of Engineering, JPN) KINOSHITA TOMOHIRO (Okayama Univ., Faculty of Engineering, JPN) MATSUISHI TAKUYA (Okayama Univ., Faculty of Engineering, JPN) MATSUNAGA SHIGEKI (Okayama Univ., Faculty of Engineering, JPN) TOYOTA YOSHITAKA (Okayama Univ., Faculty of Engineering, JPN) WADA OSAMI (Okayama Univ., Faculty of Engineering, JPN) KOGA RYUJI (Okayama Univ., Faculty of Engineering, JPN) FUKUMOTO YUKIHIRO (Matsushita Electric Industrial Co., Ltd., JPN) SHIBATA OSAMU (Matsushita Electric Industrial Co., Ltd., JPN)
Journal Title;IEICE Transactions on Communications (Japanese Edition)
Journal Code:S0622C
ISSN:1344-4697
VOL.J86-B;NO.2;PAGE.226-235(2003)
Figure&Table&Reference;FIG.13, TBL.2, REF.19
Pub. Country;Japan
Language;Japanese
Abstract;One of main causes of electromagnetic radiation noise on digital substrates is high frequency current flowing source terminals of IC/LSI. Authors have already proposed a model on high frequency current flowing the source terminals of IC/LSI. And, they have also developed analytical method to rapidly simulate electromagnetic radiation based on source and ground resonance of printed circuits. In this paper, was shown by combining them to apply the current model flowing source terminals to EMI simulation that actual testing and simulation on edge voltage and EMI of substrates agreed with good precision. And then, by adding bipass condensors and decoupling inductors to the model, here was described the source terminal current could be reduced to reduce EMI together with its reduction mechanism. Furthermore, by carrying out comparison between the simulation and actual testing of EMI, EMI reduction effect when carrying out internal decoupling was also verified.
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