Semiconductor Molding Compound for Lead-Free Soldering.
|
Accession number;03A0150721
|
| Title;Semiconductor Molding Compound for Lead-Free Soldering. |
| Author;
SHIRAKI HIROYUKI
(Matsushita Electric Works, Ltd., JPN)
WADA TATSUYOSHI
(Matsushita Electric Works, Ltd., JPN)
|
Journal Title;MEW Technical Report
|
Journal Code:S0151A
|
ISSN:0285-5054
|
|
VOL.;NO.80;PAGE.13-17(2003)
|
| Figure&Table&Reference;FIG.8, TBL.3 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;The semiconductor molding compound, which can resist a higher reflow temperature used for lead-free soldering of the components on the board, has been developed by improving the high-temperature toughness obtained by using resin with a stiff linear chain structure and high reactivity. The improved resistance to moisture, adhesion and stiffness compared with the conventional material, resulted in a better anti-crack performance. In addition, the high rate of filler content and other measures guaranteed the flame-retardant characteristics without using flame-retardants. (author abst.) |
|
|
|
Related Articles;
|
|
