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Accession number;03A0150722
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| Title;Heating Method for Lead-Free Solder Reflow Oven. |
| Author;
NAMEKAWA MASARU
(Matsushitadenkomashin'andobijon)
MIZOGUCHI MITSUNORI
(Matsushitadenkomashin'andobijon)
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Journal Title;MEW Technical Report
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Journal Code:S0151A
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ISSN:0285-5054
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VOL.;NO.80;PAGE.18-22(2003)
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| Figure&Table&Reference;FIG.10, REF.4 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;In order to provide a reflow process for lead-free solder joints requiring high-temperature uniform heating, two types of equipment, an "RA" air-reflow oven and an "RN" N2-reflow oven have been developed by using the "dual-sided matrix jet circulation heating method". The heating system consists of two sets of the same hot-air circulation system, each of which blows hot air on the top and bottom surfaces of a PC board with blow nozzles and suction nozzles arranged alternately in a matrix fashion for the circulation of hot air. By employing this design, the peak temperature variations on a board can be reduced for reflow soldering of lead-free solder material, which has a higher melting point than that of conventional lead-based eutectic solder. Further, the thermal damage on the mounted components for providing high-quality reflow soldering can be eliminated. (author abst.) |
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