Junction Characteristics of Sn-Ag Based Lead-Free Solder for Electonic Packaging.
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Accession number;03A0150723
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| Title;Junction Characteristics of Sn-Ag Based Lead-Free Solder for Electonic Packaging. |
| Author;
TATSUTA JUN
(Matsushita Electric Works, Ltd., JPN)
KUBO MASAO
(Matsushita Electric Works, Ltd., JPN)
TANAKA KYOJI
(Matsushita Electric Works, Ltd., JPN)
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Journal Title;MEW Technical Report
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Journal Code:S0151A
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ISSN:0285-5054
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VOL.;NO.80;PAGE.23-29(2003)
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| Figure&Table&Reference;FIG.15, TBL.6, REF.7 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;It was shown clearly that in the junction of lead free solder (Sn-3.0Ag-0.5Cu or Sn-2.5Ag-0.5Cu-1.0Bi) and component electrodes which performed the surface treatment which does not contain Ph generating of defects, such as lift-off, a crack, and a junction on-the-strength fall, can be controlled. In utilization of lead free solder, it is necessary to secure the reliability more than Sn-37Pb solder joint. For that purpose, not to mention optimization of process, the design of the material which constitutes a solder joint is important, and it is indispensable to the creation which high reliability products continued to build these as design criteria. If the combination of the lead free solder (Sn-3.0Ag-0.5Cu or Sn-2.5Ag-0.5Cu-1.0Bi) and component electrodes which performed the surface treatment which does not contain Pb is used, it was obtained the joint quality of lead free solder more than Sn-37Pb. In consideration of these results and efficient on a process of composition managements etc, Sn-Ag-Cu solder is selected to the standard solder of our company, and we continue to create lead free solder products for lead solder abolition. (author abst.) |
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