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Accession number;03A0150724
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| Title;Method of Controlling Lift-Off Phenomenon in Lead-Free Soldering. |
| Author;
UEDA TOMOHIKO
(Matsushita Electric Works, Ltd., JPN)
MAKINO ATSUSHI
(Matsushita Electric Works, Ltd., JPN)
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Journal Title;MEW Technical Report
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Journal Code:S0151A
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ISSN:0285-5054
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VOL.;NO.80;PAGE.30-34(2003)
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| Figure&Table&Reference;FIG.13, REF.3 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;The method of controlling lift-off which is the characteristic defect of lead-free solders has been found from the incidence of lift-off by the composition of solders and the plating of part's terminals and so on. Furthermore, we considered the mechanism of lift-off phenomenon by the analysis of metallic composition. People fear that lift-off has a bad influence on the reliability of lead-free solders because Lift-off is the phenomenon that a solder fillet peels off from a Cu land of a board. We have found it is available for the control of lift-off phenomenon that using Bi-free solders and lead-free plating for part's terminals, and slowing the conveyor's speed at the lead-free soldering. Moreover, we have confirmed that the peeling distance between a solder and a Cu land do not spread at reliability estimation. (author abst.) |
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