Method of Predicting Thermal Fatigue Life of Lead-Free Solder Joints.
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Accession number;03A0150725
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| Title;Method of Predicting Thermal Fatigue Life of Lead-Free Solder Joints. |
| Author;
ONO KOICHI
(Matsushita Electric Works, Ltd., JPN)
MOTOYAMA AKIRA
(Matsushita Electric Works, Ltd., JPN)
UODOME HIDEJI
(Matsushita Electric Works, Ltd., JPN)
KUROI SHUICHI
(Matsushita Electric Works, Ltd., JPN)
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Journal Title;MEW Technical Report
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Journal Code:S0151A
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ISSN:0285-5054
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VOL.;NO.80;PAGE.35-39(2003)
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| Figure&Table&Reference;FIG.7, TBL.2, REF.1 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;An acceleration formula of a temperature cycle test was developed by using a specimen consisting of a paper-phenolic printed-circuit board and a connector made from nylon 66, joined to each other with lead-free solder. This setup enabled the prediction of the Sn-Ag-Cu lead-free solder joints' life in actual operating conditions by using temperature cycling tests. In deriving the acceleration formula, an unknown number n and activation energy were quantified based on the experimental equation by Conffin-Manson. (author abst.) |
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