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Accession number;03A0493401
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| Title;New Flip Chip Technology Using Gold-Bumped Chip with Pre-Coated Adhesive Resin |
| Author;
MIYAZAKI T
(Nec Electronics Corp.)
YOSHINO R
(Nec Electronics Corp.)
KATA K
(Nec Electronics Corp.)
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Journal Title;NEC Res Dev
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Journal Code:G0138A
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ISSN:0547-051X
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VOL.44;NO.3;PAGE.225-230(2003)
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| Figure&Table&Reference;FIG.12, TBL.5, REF.4 |
| Pub. Country;Japan |
| Language;English |
| Abstract;We have developed a new Flip Chip technology. Features of the technology are as follows: 1) It has gold bumps, 2) It has pre-coated adhesive resin before dicing, 3) Gold bumps tale are projected from adhesive resin, 4) It enables bonding to the substrate pad and encapsulation simultaneously. (The technology will be referred to as B2 (Bump Bond)-chip in this paper.) Two types of adhesives for B2-chip according to adhesive layer formation method have been developed, and also two types for each according to condition of mounting for high temperature and low temperature (US bonding) also have been developed and we have investigated optimum conditions. B2-chip prototype using lamination process has been fabricated to be evaluated its bond-ability and reliability. We have confirmed that B2-chip has sufficient reliability and capability of bonding and encapsulation. (author abst.) |
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