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Accession number;03A0493403
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| Title;Real Chip Size 3-Dimensional-Stacked Package |
| Author;
YAMAZAKI T
(Nec Corp.)
YOSHINO R
(Nec Electronics Corp.)
KATA K
(Nec Electronics Corp.)
SOGAWA Y
(Nec Corp.)
HAZEYAMA I
(Nec Corp.)
KITAJO S
(Nec Corp.)
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Journal Title;NEC Res Dev
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Journal Code:G0138A
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ISSN:0547-051X
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VOL.44;NO.3;PAGE.235-240(2003)
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| Figure&Table&Reference;FIG.9, TBL.3, REF.6 |
| Pub. Country;Japan |
| Language;English |
| Abstract;A high-density packaging technology is necessary to realize miniaturization and better performance of mobile electronics products like cellular phones and personal digital assistants. One of the most promising technologies is three-dimensional (3D)-stacked packaging technology. This paper describes a newly developed ultra high-density 3D-stacked package called a flexible carrier folded real chip size package (FFCSP). The stacked-FFCSP is fabricated by stacking very thin single chip packages (single-chip FFCSP) of real chip size on top of one another. Each single chip FFCSP consists of an LSI chip and a small piece of flexible printed circuit (FPC), which has an insulating layer made of thermoplastic resin. The advantages of the stacked-FFCSP are its small size, thinness, highly flexible assembly, and good test yield compared with conventional stacked multi-chip packages (S-MCPs). The FFCSP will enable future miniaturization and raise the functionality of the next trend of mobile electronics products. (author abst.) |
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