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Accession number;03A0493405
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| Title;Thermal Fatigue Mechanisms of CSP Solder Joints on PWB |
| Author;
OHTA H
(Nec Corp.)
NISHIMURA N
(Nec Corp.)
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Journal Title;NEC Res Dev
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Journal Code:G0138A
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ISSN:0547-051X
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VOL.44;NO.3;PAGE.246-250(2003)
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| Figure&Table&Reference;FIG.7, TBL.1, REF.2 |
| Pub. Country;Japan |
| Language;English |
| Abstract;Although temperature cycling tests are performed as a technique for evaluating the long-term reliability of chip scale packages (CSP) and other electronic parts, since a temperature cycling test requires a period of approximately three months to complete 1,000 cycles, from the standpoint of strengthening product development capability, shortening of the test period is in order. Accordingly, in this paper we investigated the thermal fatigue mechanisms of solder in temperature cycling tests with the goal of developing a shortened technique for temperature cycling tests. By analyzing the crystal orientation of solder using Electron BackScatter diffraction Pattern (EBSP) methods as the technique for solder joint analysis, it became clear that repetitive stress from thermal expansion and thermal shrinkage influences the Thermal Fatigue mechanism of Sn-Ag-Cu lead-free solder joints of CSP in a temperature cycling test, and that heat itself has little influence on a solder joint. (author abst.) |
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