|
Accession number;03A0493406
|
| Title;Delamination by Reheating in SMD Solder Joint Using Lead-Free Solder |
| Author;
MOMOKAWA Y
(Nec Corp.)
ISHIZUKA N
(Nec Corp.)
|
Journal Title;NEC Res Dev
|
Journal Code:G0138A
|
ISSN:0547-051X
|
|
VOL.44;NO.3;PAGE.251-255(2003)
|
| Figure&Table&Reference;FIG.7, TBL.2, REF.2 |
| Pub. Country;Japan |
| Language;English |
| Abstract;We have been researching and developing reflow and wave soldering technologies for Pb-free solder. In this research, the effect of the reheating process, which consists of both reflow and wave soldering, was investigated. Consequently, it was understood that a quad flat package (QFP) solder joint previously formed by reflow soldering delaminated at the interface in wave soldering. In order to control the delamination, the delamination mechanism was researched. As a result, it became clear that the delamination factors were Pb mixing with the lead plating, increase of temperature in the reheating process and part and/or substrate warping. Delamination occurred only when all these factors were present. (author abst.) |
|
|
|
Related Articles;
|
