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Accession number;03A0493407
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| Title;Development of Environmentally Safe Flame-Retarding Epoxy Resin Compounds without Halogen and Phosphorous Derivatives and Their Application to Printed Wiring Boards |
| Author;
KIUCHI Y
(Nec Corp.)
IJI M
(Nec Corp.)
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Journal Title;NEC Res Dev
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Journal Code:G0138A
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ISSN:0547-051X
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VOL.44;NO.3;PAGE.256-262(2003)
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| Figure&Table&Reference;FIG.11, TBL.1, REF.9 |
| Pub. Country;Japan |
| Language;English |
| Abstract;We have developed self-extinguishing epoxy-resin compounds that contain no environmentally hazardous flame retardants such as halogen or phosphorous derivatives, and used them to develop glass epoxy laminates for printed wiring boards (PWBs). The new epoxy-resin compounds, which mainly consist of phenol-aralkyl-type epoxy resins and hardeners, formed stable foam layers that retarded heat transfer, and thus were self-extinguishing. A laminate consisting of one of the new epoxy-resin compounds with safe metal hydroxides, which absorb heat during combustion, showed high flame retardancy. We achieved excellent flame retardancy (UL94V-O) of the new laminate by adding far less aluminum hydroxide (less than 50% by weight) than in laminates containing conventional epoxy-resin compounds. Especially beneficial is the fact that the new laminate with the hydroxide exhibits good practicality and can withstand the higher temperature required for lead-free soldering. Furthermore, the laminate can be safely disposed of by incineration or reclamation, and it can also be thermally recycled. (author abst.) |
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