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Accession number;04A0306005
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| Title;Technical Trends in High Performance Copper Alloy Strip for Lead Frame and Kobe Steel's Development Strategy |
| Author;
NOMURA KOYA
(Kobe Steel, Ltd., JPN)
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Journal Title;Kobe Steel Engineering Reports
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Journal Code:F0164A
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ISSN:0373-8868
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VOL.54;NO.1;PAGE.13-18(2004)
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| Figure&Table&Reference;FIG.5, REF.9 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;Copper alloy for lead frames is a key semiconductor package material. Different interface reactions occur at the junction of semiconductor package, copper alloy, and other materials. These are explained in this paper. Moreover, in order to determine future demand and performance, the properties of copper alloy for lead frames are classified in this paper according to the purpose of the semiconductor package. In near future, improved copper alloy adhesion to the mold resin will become increasingly important. (author abst.) |
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