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Accession number;04A0306011
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| Title;Embedding Effects of the High-pressure Annealing Process Via Minute Holes and Trenches in Dual Damascene Copper Interconnections |
| Author;
ONISHI TAKASHI
(Kobe Steel, Ltd., JPN)
YOSHIKAWA TETSUYA
(Kobe Steel, Ltd., JPN)
MUNEMASA JUN
(Kobe Steel, Ltd., JPN)
FUJII HIDEO
(Kobelco Res. Inst. Inc., JPN)
INOUE TAKAO
(Kobelco Res. Inst. Inc., JPN)
MIYAGAKI AKI
(Kobelco Res. Inst. Inc., JPN)
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Journal Title;Kobe Steel Engineering Reports
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Journal Code:F0164A
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ISSN:0373-8868
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VOL.54;NO.1;PAGE.44-51(2004)
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| Figure&Table&Reference;FIG.15, TBL.2, REF.28 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;The embedding effect of Cu films in a high-pressure annealing process was investigated for application to dualdamascene fabrication technology for Cu interconnections in LSIs. The thermal elasticity and plasticity analysis based on a finite-element method (FEM) predicts that additional external pressure acts to push Cu films into the via holes. This analytical result agrees well with the actual hole filling performance. Additional external pressure reduces the incremental creep strain of Cu during the heating and holding step and reduces the stress transition point during the cooling step. This indicates that the high-pressure annealing process is effective for perfect Cu filling into holes and in suppressing the siphoning phenomenon in Cu from holes. (author abst.) |
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