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Accession number;04A0357700
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| Title;A consideration for the evalation of MEMS devices low stress packaging using Piezo-resistive pressure sensor elements. |
| Author;
AKAI SUMIO
(Senkoyugogijutsuken Handotaikaise)
GOTO KOJI
(Senkoyugogijutsuken Handotaikaise)
MIYAJIMA HISAKAZU
(Senkoyugogijutsuken Handotaikaise)
TAKAMI SHIGENARI
(Senkoyugogijutsuken Handotaikaise)
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Journal Title;Transactions of the Institute of Electrical Engineering of Japan. E
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Journal Code:L3098A
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ISSN:1341-8939
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VOL.124;NO.5;PAGE.172-178(2004)
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| Figure&Table&Reference;FIG.15, REF.4 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;The performance of MEMS devices are influenced by the structure surrounding MEMS devices strongly because the ourput of it is small and moreover it is complex and minute structure. For such MEMS devices, low stress packaging is indispensible to high performance and high reliability.In this paper, the method for stress evaluating from the package of MEMS devices was shown on the basis of electrical characteristic of (100) pressure sensor.In addition, low stress of the stress buffer structure package was verified on the basis of this evaluation method.Results are as follows.1)In respect of the stress from the package of MEMS devices, the evaluation by offset voltage fluctuation of (100) pressure sensor was carried out.2)By stress buffer structure which utilized characteristics of the die bond material, offset voltage fluctuation of (100) pressure sensor can be reduced in ratio to convention of 20%.3)It is possible to applicate to the device using piezoresistance elements such as acceleration sensor. |
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