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Accession number;06A0102402
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| Title;Analysis for warp mechanism at reflow soldering PCB Assembly |
| Author;
ENOMOTO YOICHI
(Pioneer Corp., JPN)
MAMIZUKA HISASHI
(Pioneer Corp., JPN)
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Journal Title;Pioneer R&D
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Journal Code:L0992B
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ISSN:1346-7468
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VOL.16;NO.1;PAGE.14-24(2006)
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| Figure&Table&Reference;FIG.16 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;We analyzed the generation mechanism of PCB warping, which is a cause of SMT defects in reflow soldering We developed equipment for three-dimensional(3D) direct observation and measured the displacement which is generated in reflow soldering of a PCB Assembly using this. We used the area of the copper foil on the PCB, the directionality of wiring and the mounting part patterns as parameters, and observed the influence of each parameter on PCB warp. As a result, it has been understood that the state of the copper foil has an important influence on the occurrence of warping in the PCB. In addition we are attempting to decrease the warping of PCB assembly mounted BGA. (author abst.) |
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