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Accession number;06A0102405
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| Title;The latest technology of PCB unit test |
| Author;
OGAWA KEN'ICHI
(Pioneer Corp., JPN)
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Journal Title;Pioneer R&D
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Journal Code:L0992B
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ISSN:1346-7468
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VOL.16;NO.1;PAGE.40-47(2006)
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| Figure&Table&Reference;FIG.10, REF.3 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;We developed inspection technology which can examine PCB units with high mounting density, and find the causes of defective units. Introduction of a multi purpose tester platform (PucWin) that can execute "Compound Multi-function Testing", and an algorithm developed for specifying defective locations on a PCB, and a program for controlling this, enabled the use of an ICE (In Circuit Emulator). As a result, the inspection technology is able to test the state of connection of ROM/RAM which is installed with the PCB unit and to specify the cause of any defects. Moreover the inspection technology achieved shorter inspection time of PCB units. (author abst.) |
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