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Accession number;06A0102407
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| Title;Report of activity for raising solder quality |
| Author;
FUKUYAMA TAKASHI
(Pioneer Corp., JPN)
SATO KAZUHIRO
(Pioneer Corp., JPN)
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Journal Title;Pioneer R&D
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Journal Code:L0992B
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ISSN:1346-7468
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VOL.16;NO.1;PAGE.57-70(2006)
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| Figure&Table&Reference;FIG.20, TBL.5 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;In order to realize high performance and increased functionality of products, increases in mounting density and the miniaturization of parts are ongoing. Given these circumstances, finding new ways of improving soldering quality is an important subject. We are taking various measures to investigate how improvement of soldering quality can be advanced beyond the present methods. We measured various parameters such as the amount of solder printing and component loading accuracy which have a big influence on quality in the reflow process, and established two management methods which reduced the number of soldering defects in the process. One is "ganagement of the volume of solder printings" which controls the amount of solder at the reflow process, with "Absolute management of the amount" and "Management of the relative amount". "Absolute management of the amount" uses a reference of constant value regardless of product, and "Management of a relative amount" uses a reference value varied corresponding to each product. The other is "anagement of part loading accuracy" using the reference which is decided by the installing accuracy of each part installed in the product, depending on the performance of the mounter. It has been understood that we will be able to reduce solder defects at the reflow process by the established management. (author abst.) |
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