THERMOPHYSICAL PROPERTY MEASUREMENT OF THERMAL CONDUCTIVE RESIN IN THERMAL DESIGN OF ELECTRONIC DEVICE
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Accession number;07A0043245
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| Title;THERMOPHYSICAL PROPERTY MEASUREMENT OF THERMAL CONDUCTIVE RESIN IN THERMAL DESIGN OF ELECTRONIC DEVICE |
| Author;
OSONE YASUO
(Hitachi, Ltd., JPN)
NAKAZATO NORIO
(Hitachi, Ltd., JPN)
KUBO TAKASHI
(Nagoya Univ., JPN)
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Journal Title;Thermophys Prop
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Journal Code:X0031A
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ISSN:0911-1743
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VOL.27th;NO.;PAGE.127-129(2006)
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| Figure&Table&Reference;FIG.3, REF.2 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;Industrial products using grease and resin at an interface between structural members are used over a wide range of industrial fields, for example, in the case in which a semiconductor devices and a radiating plate are joined through a thermal-conductive resin, the case in which resin is molded or applied between members and baked, the case in which gel resin is used in a state sandwiched between members, and the case in which a semiconductor device and a radiating plate are joined with an electrically conductive adhesive. In such a product field in which heat flows through the resin, a value obtained by dividing, with an amount of passing heat, a temperature difference produced when the heat passes through the resin, that is, thermal resistance is extremely important for designing the products. The thermal resistance. of the resin comprises as its components the thermal resistance caused by conduction of heat passing through the resin itself and an interface thermal-resistance produced at interfaces between the resin and the members sandwiching the resin therebetween from both side. It is impossible to accurately predict a temperature rise of the products, without the consideration on the influence of the interface thermal-resistance when products have a structure in which heat escape through resin. For the thermal design of electronic devices, the thermal resistance of the device is much more important than the thermophysical properties, such as the thermal conductivity, specific heat, and the thermal diffusivity of the material used in the device. And the certainty of thermophysical property measurement of resin should consider the influence of the interface between the resin and the members, the assemble processes of the resin, and the change in thermophysical properties with time.... (author abst.) |
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