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Accession number;05A0249024
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| Title;Particularly extended wetting of liquid copper on solid iron plate that is oxidized on the surface. |
| Author;
TAKAHIRA NOBUYUKI
(Osaka Univ., Grad. Sch.)
RI SHUNKO
(Osaka Univ., Grad. Sch.)
TANAKA TOSHIHIRO
(Osaka Univ., Grad. Sch.)
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Journal Title;Current Advances in Materials and Processes
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Journal Code:X0994A
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ISSN:0914-6628
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VOL.18;NO.1;PAGE.P8(2005)
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| Figure&Table&Reference;FIG.2, REF.1 |
| Pub. Country;Japan |
| Language;Japanese |
| Abstract;The mechanism of the particularly extended wetting of a liquid copper drop placed on an iron plate in reducing atmosphere is investigated as a possibility for removal of copper as a trump element in iron, and the effects of the oxygen partial pressure is examined. The results obtained show that when an iron plate is oxidized and reduced, a porous layer of about 80.MU.m thick is formed on the iron plate surface, and liquid copper tends to penetrate in these fine pores by the capillary action. When the atmosphere is stable for iron oxide, there is a possibility that liquid copper can wet the iron surface. |
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