Three-Dimensional Measurement Technologies for Advanced Manufacturing
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Accession number;07A0159262
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| Title;Three-Dimensional Measurement Technologies for Advanced Manufacturing |
| Author;
TSUKAHARA HIROYUKI
(Fujitsu Lab. Ltd.)
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Journal Title;Fujitsu Sci Tech J
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Journal Code:S0076A
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ISSN:0016-2523
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VOL.43;NO.1;PAGE.76-86(2007)
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| Figure&Table&Reference;FIG.17, TBL.1, REF.29 |
| Pub. Country;Japan |
| Language;English |
| Abstract;Three-dimensional (3D) measurement is a very important elemental technology in manufacturing. Because of the increasingly fine structures of modern components, this technology must be extremely fast and accurate. At Fujitsu, because we manufacture semiconductors, hard disk drives, display elements, and micro electro mechanical systems (MEMS) devices, 3D measurement technology that enables fast, accurate measurement of solid shapes in the sub-micron to sub-nanometer region has become essential. In this paper, we introduce examples of how triangulation and optical interferometry are used in the 3D measurement technologies that have been developed so far and then look at some future developments. First, we describe a high-speed solder bump-height measurement system that uses triangulation. Next, we describe technologies that use optical interferometry to measure the slider ABS and disk micro-waviness of magnetic disks and the light-guiding plates for display elements. Finally, we introduce a technology for measuring the dynamic behavior of MEMS devices. (author abst.) |
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