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DENSO Tech Rev

ITS Technologies for Ecology.
Environmentally-Friendly Products by DENSO.
Development of Reinforced Thin Wall Ceramic Substrate.
Development of a Higher Performance Alternator.
Development of New Concept Air Cutain (Air Return System) for Idling-stop of Transport Refrigerator. Suppressing Door Opening Heat Load.
Development of Natural Refrigerant (CO2) Hot Water Supplier for Residential Use.
Thermoplastic Film Based Multilayer Printed Circuit Board and Corresponding Material Recycle System.
RFID Application for Recycling System.
Development of Environment-Conscious Oil Filter and Its Production System.
Environmental Management Efforts at DENSO. DENSO'S Eco-vision 2005.
Boiling Refrigerant Type Cooling Unit (Compact Cooling Unit for Computer Chip).
Development and Deployment of SOL!BOX.
Focus to Production Engineering for the Module at Automotive Parts Manufacturers.
2
Lubrication Mechanism of Slide Way and Material Technology.
Current Status and Future Prospects of Material Engineering R&D in DENSO.
Activity of Ecological Material Research.
A New Electrical Steel for a Newly Developed High Efficiency Alternator Corresponding to Energy Saving of Car.
Development of a Cooling Module Containing a Radiator and a Condenser. Part2. Alloy Development.
Electrolytic Phosphating Process for Pretreatment of Painting.
Development of Technology for Mass-production of CrN Film.
Evaluation Method of Cellular Phone Design.
Material Development of Automobile Plastic Pulley.
Analysis of Polymer-Adhesion Interfaces.
Analysis of Dielectric Breakdown Life for Anisotropic Conductive Film Adhesion.
The Development of Simulation Technology of Heat Curing Processes of Resins.
Effect of Casting Defect on the Fatigue Strength of Aluminum Die Casting Materials.
Development of Long Life Carbon Brush.
Seizure Mechanism of Ceramics with Metal.
Calculation of Experimental Equation to Predict Cavitation Erosion Level.
Well-skilled Group Supporting Production Engineering.
Wireless Link System for Communication and Energy Transmission of Microrobot.
A Single Chip Automotive Control LSI Using SOI Bipolar Complimentary MOS Double-Diffused MOS.
Fluxless Joining of PWB and FPC Using Thermoplastic FPC.