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List of Jounal Titles
A to Z index of Journal Title. Choose a letter.
Int Conf Electron Packag
2006
- What's the Jisso Technology for Next Generation Automotive Electronics
- Advanced Semiconductor Packaging Technology
- Micro-Mirror Array Fabricated Using Magnetic Alignment
- Ceramic Wafer Scale Packaging Technology for MEMS Devices
- STP Technology for MEMS Devices Packaging
- Self-Written Waveguide Optical Pin Fabricated Using Photomask Transfer Method
- Optical Connection Rod on VCSEL using Self-Written Waveguide by Mask-Transfer Process
- Yield Based Manufacturing Cost Methodology for Advanced Packaging Technology Comparison
- Correct Reflow Machine makes your Process Robust
- The Chip-on-Glass Bonding Using Non-conductive Adhesive and Sn bump: Effect of Sn Bump Types on the NCA trapping
- Formation of Kirkendall Voids in the Reactive Diffusion between Cu and High-lead Solders
- Characteristics of Bonding Process Using Ag Metallo-Organic Nanoparticles
- Embedded Chip Build-Up BGA for High-End Processors
- Embedded Capacitor Technology on FR-4 Using Aerosol Deposition
- Preparation and Evaluation of Embedded Passive Thin Film Capacitor by Using Semiconductor Technology
- Process Development and Surface Characterization on Liquid Crystalline Polymer Substrate Based System on Package with Chip Embedded for Electronic Application
- Embedding Discrete Components into Organic Substrates
- Development of Embedded Organic Module Technology
- Thin film embedded passive technology for system integration
- Development of the Embedded Passive Substrate and High Frequency Characteristics
- Newly Developed Solvent-Casting Type LCP Film Suitable for PCB Applications
- Reworkable Underfill which Yield Plastic Flow before Cure
- Filler Size Effect of Underfill in Flip-chip Package
- Thermal Characteristics and Morphology of Semi-conducting Poly(9,9'-dioctylfluorene-co-bithiophene) Film
- Paradigm shift for PWB surface finishes in mobile phone terminals.
- Estimate of Drop Impact Reliability for BGA Solder Joints
- Open Lead Detection Based on Supply Current of CMOS Logic Circuits by AC Voltage Signal Application
- Reliability of Gold-Solder bump joint
- Enhanced Packaged Transistor Modelling for 24GHz LTCC Applications
- RF Benchmarking of LTCC Circuits up to 40GHz
- Dielectric constant analysis of low temperature co-fired ceramic substrates in GHz range
- The Development of Surface Mount Package with Differential Transmission Lines for 40Gb/s Applications
- On the Local Skew Effect on the Electrical Performance of Differential Via Structures in a Multilayer PCB
- A Vertical Transition for Packaged Transistors on LTCC Substrates for 24GHz Applications
- A Study on Magnetic Field Measurements by a High-Frequency-Carrier Type Magnetic Probe
- Viscoelastic FEM Simulation of an Underfill Resin for the Reliability Evaluation of Solder Bumps in a Flip Chip Package
- Thermal Resistance Analysis on Semiconductor Packages Using Two Mesh Models
- Reduction of Power Dissipation in Full Adder using Adiabatic Method
- Study of Impact Stress of CSP Solder Joints using Homogenization Method and FEM Drop-Simulation
- Ultimate Super-Chip Integration Based on Chip-to-Wafer Three-Dimensional Integration Technology
- Signal Integrity Between DSP and Memory in 3D Packages for Mobile Phone
- A Study of Package Flatness During Solder Reflow for Package-on-Package
- LC-VCO with Wafer level-CSP technology
- Silicon Through Hole Technology
- Impact and Opportunities of Through Silicon Via and Three-Dimensional Chip Stacking
- Room Temperature Bonding Between Stacked Chips Formed Si Through-hole Electrodes
- Through-Hole Interconnection Technologies in Si Substrate for Wafer Level Package
- Silicon Through Interconnection Technology for System Integration
- Impact reliabilities of lead-free solder joints with Ni(P), Cu and Ni metallizations
- Intermetallic compound formation between Sn and Cu or Ni
- Formation of Intermetallic Compound at Sn-Zn-Bi-In-P Lead-free Solder/Cu Interface
- Reliability of Sn/Pb, Sn/Pb/Ag, Sn/Ag/Cu and Sn/Cu/Ni Solder Joints in Cyclic Mechanical Loading
- Investigation of Whisker Formation on Tin Plating
- Consequential Toxicity Assessment of the Global Shift to Pb-free Solder Paste
- Analysis of Corrective Action's Quality provided to Customers with Mobile Terminals using Self-Organizing Maps
- Is the Productization of a Mobile Terminal Coming More Demanding?
- Bumpless Interconnect of Cu Electrodes in Millions-Pins Level
- Low Temperature Surface Activated Flip Chip Technique on Cu-Cu Interconnection in Chip-On-Flex System
- Low Temperature Bonding of Sn-Ag-Cu Solder Bumps by SAB Method
- Application of SAB on Cu/LCP Laminate
- Application of SAB on Wafer Bonding at Room Temperature
- Surface Activated Bonding Method for Ionic Wafers at Low Temperature
- Application of SAB on MEMS Packaging
- Halogen Free Material Having Low Transmission Loss Designed for Multi-layer Printed Circuit Board Applications
- The Fuzzy Approach to an Estimation of Condition of Film Resistors and Hybrid Integrated Circuits
- Development of High-Density Multilayer Flexible Printed Circuits
- In-situ Charge Observation in Insulation Layers of Printed Circuit Boards During Ageing Tests
- Development of Halogen-Free Prepreg Available for Additive Manufacturing Process
- A New Fine Patterning Method for LTCC Electrode Used with Photo-Patterned Dry Film
- The Effect of Al2O3 Particles Size on Tape Casting Properties of LTCC System of Al2O3 and Borosilicate Glass
- Development of LTCC (Low Temperature Co-fired Ceramics) Materials with High Mechanical Strength
- LTCC multi-layer Substrate Utilized with Ink-jet Printed Silver Layers and UV Laser Drilled Micro Via
- On-chip/Off-chip High Density Transmission Line Interconnect
- Current status and future outlook of SAB technology
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